The maximum thickness of the paste layer is determined wholly by the clamping pressure and coplanarity of the thermal interface. You can only end up with an excess of paste between the CPU and heatsink if a) the heatsink contact plate or CPU package aren't flat or b) the clamping mechanism isn't properly pressing them together.
Apply too much thermal paste and it'll just squeeze out of the edges, which is merely inconvenient as long as the paste is reasonably non-conductive. Apply too little paste and you'll get air gaps, which have terrible thermal conductivity. If in doubt, just spread the paste to ensure that it fully covers the contact area.
Apply too much thermal paste and it'll just squeeze out of the edges, which is merely inconvenient as long as the paste is reasonably non-conductive. Apply too little paste and you'll get air gaps, which have terrible thermal conductivity. If in doubt, just spread the paste to ensure that it fully covers the contact area.
https://www.gamersnexus.net/guides/3346-thermal-paste-applic...
https://www.youtube.com/watch?v=r2MEAnZ3swQ